Ceramic –based Copper Clad Laminate Sheet

Editor:【HAOJINGHUI INDUSTRIAL】 Time:【2014.09.18】 Views:【836】

Features:

Excellent performance of moisture proof, salt spays proof and fungus proof;

Excellent high frequency performance;

Excellent thermal conductivity;

Thermal expansion coefficient close to silicon, has good dimensional stability

 

Application:

High-power integrated circuit module;

Electronic power modules;

Smart power modules;

High-frequency and high –power switching power supply;

Antomotive electronics components etc.

 

Specification:

Base thickness: 0.635mm, 1.0mm

Copper: 0.005mm-0.2mm

Size: 114*114mm, 114*165mm

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