Features:
Excellent performance of moisture proof, salt spays proof and fungus proof;
Excellent high frequency performance;
Excellent thermal conductivity;
Thermal expansion coefficient close to silicon, has good dimensional stability
Application:
High-power integrated circuit module;
Electronic power modules;
Smart power modules;
High-frequency and high –power switching power supply;
Antomotive electronics components etc.
Specification:
Base thickness: 0.635mm, 1.0mm
Copper: 0.005mm-0.2mm
Size: 114*114mm, 114*165mm
Web:www.hjhelec.com TEL:0086 898 68929110 FAX:0086 898 68929110 Email:hjh01@hjhelec.com